6月15日，美国加州大学戴维斯分校Zhang Yu 博士来参观我中心并做了题为“High-Density Wafer-Scale 3D Silicon Photonic Integrated Circuits for Scalable LIDAR system”的学术报告。

报告以英文的方式进行，讲述激光雷达的应用等方面，老师与同学们兴趣盎然，积极互动，反响甚好。

Abstract:

Wafer-scale 3D integration is a very active trend in the electronics industry.  3D NAND memory has already been ubiquitous for more than a decade, and recent efforts extended to integrating processor and memory planes in 3D to overcome the von Neumann bottleneck.  On the other hand, photonic integration efforts so far mostly stayed with 2D (2D PIC) because it already offered high channel capacity and high bandwidth thanks to wavelength division multiplexing (WDM) while avoiding similar constraints due to skin effects and impedance.   3D photonic integration has recently emerged as very important steps for bringing new functionalities and high degrees of integration to microsystems.  3D Photonic Integrated Circuits (3D PICs) overcome many limitations of 2D PICs where all photonic components must reside on the same plane.  As we will discuss in this talk, 3D PICs allow multiple functionalities on multiple planes of 2D PICs to achieve combined functions on a limited footprint.  3D PIC based on silicon photonics is extremely important because it combines low-energy operation, high-density functionalities, and high-yield manufacturing on a CMOS platform already developed for 3D electronic integration.

In this talk, we will discusses design, fabrication, and characterization results of new high-density 3D photonic integrated circuit being developed for LIDAR imaging systems.In particular, we will detail the design and fabrication of the vertical U-shaped couplers that enables 3D light transport within 1 mm3 volume with subwavelength element pitch and a proof-of-concept illustration of silicon photonic unit cell optical phased array. Our latest efforts on a wafer-scale interposer as an optical backplane and its coupling to silicon photonic unit cell will also be introduced.

Biography:

Dr. Yu Zhang is anassistant project scientist in the Department of Electronic and Computer Engineering at the University of California, Davis. He received his PhD in Electronic and Computer Engineering from the Hong Kong University of Science and Technology in 2016. He then joined the University of California, Davis asa postdoc researcher and was later promoted to assistant project scientist.His current research interest focuses on 3D integrated silicon photonic optical phased array, hybrid silicon tunable laser and phase modulators and silicon photonic integrated circuit enabled all-to-all interconnection for scalable high-performance computing systems.